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USB 3.0 Connector Market Take-Off Creating A Complete Ecosystem Is The Key
Apr 04, 2018

The USB 3.0 market seems to have finally taken off. The recent USB Design Forum (USB-IF) certification passed nearly 120 USB 3.0-compliant (SuperSpeed USB) products. The transfer rate of USB3.0 can be increased from 480Mb per second of USB2.0 to 5G per second. USB-IF said that this batch of certified products covers motherboards, laptops, storage controllers, hard drives, PCI Express, and individual chips. According to estimates of IDC, an international research institute, the demand for USB 3.0 chips in 2010 was 12.45 million. In 2011, it will have the opportunity to jump to 100 million. USB3.0 can be described as "promising prospects," and various people began to take turns and attack this new era of epoch-making transmission technology.

 After all, USB 3.0 is a brand new specification and it faces many challenges. Building a complete ecosystem is a top priority. From the Host to the Hub to the Device, all aspects need to be considered. In terms of Host-side control chips, in order to achieve a transmission speed ten times that of USB 2.0, the USB 3.0 control chip must use a more advanced process. Moreover, in addition to the complex specifications and the need to have complete compatibility for USB 1.0 and USB 2.0, it is also necessary to meet the requirements of low power consumption and intelligent power management. Manufacturers should be cautious.

  In the hub stage, because the USB3.0 device end will not be too many, do not use too many ports, coupled with a large number of ports, the power consumption will be high, compatibility is also more difficult to design, and therefore face a lot of design Challenges, especially USB-IF compliance testing and future user experience are all important aspects.

  The development of the USB3.0Device controller chip is relatively easy, but at present, it is faced with the situation of “contending for a hundred schools of thought”. Everyone is not trying to mass-produce the speed, or is pushing the price down. Wei Junxiong, a senior marketing manager at Genesys Technology, said that in addition to the low power consumption, low temperature, and high performance of the USB 3.0 Device chip, the compatibility of the USB3.0 and USB2.0 features must not be overlooked. However, due to the high price of Host-side chips and the fact that the market is not yet popular, the pace of development of Device-side chip makers has been slowed down.

  At the same time, USB-IF has not yet developed a plan for how to conduct certification tests in connection with important accessories such as connectors and hubs, and the progress of USB-IF is still somewhat behind the market. The creation of an ecosystem requires the joint efforts of USB-IF, OEMs, equipment manufacturers, and chip makers to achieve a win-win situation.